Technology

The Industry’s Preferred VCSEL Technology Platform.

Innovation for Next-Generation Applications

Backed by trusted partners and driven by a spirit of innovation, TriLumina delivers a VCSEL technology platform capable of low-cost, small form facto and high power illumination for laser radar (LiDAR) and 3D-Sensing.

Innovative TriLumina illumination solutions pave the way for next-generation applications. Its illumination modules enable all solid-state LiDAR and 3D-sensing without the need for mechanical systems or MEMs devices. The all solid-state flash architecture enables co-existence (through pulse coding) with other LiDAR and 3D-sensing systems.

 

Innovation for 3D-sensing and LiDAR Applications

Multi-mode CMOS sensors can add 3D-sensing, which will become mainstream in automotive, consumer and industrial applications requiring vision, imaging and/or LiDAR. TriLumina’s 940nm VCSEL arrays with versatile optical and electrical configurations are ideal for multi-mode sensor and flash architectures in both external and in-cabin applications.

TriLumina imaging illumination module advantages:

  • Innovative flip-chip VCSEL array approach for performance and design flexibility
  • Full or segmented FoV illumination
  • All solid-state – no moving parts for full FOV or segmented illumination
  • Engineered solutions for eye safety
  • Standardized, scalable manufacturing processes
  • Over 40 U.S. patents, granted and pending

 

Innovators Partnering with Innovators

TriLumina partners with Asia-based manufacturing leaders for Epitaxial Wafer Growth, Wafer Fabrication, and Assembly & Test, as well as development and market partners. We also work closely with our customers, including Tier 1 Automotive Suppliers, Industrial Equipment and Automation Suppliers and Consumer suppliers to advance tomorrow’s technologies.

BACK-EMITTING FLIP-CHIP TECHNOLOGY

Flip-chip approach enables design flexibility while utilizing scalable, standard manufacturing processes. In addition, the flip-chiped VCSEL architecture virtually eliminates parasitics enabling very short, high quality optical pulses.

BUILT-IN SEGMENTATION

Using microoptics and diffusers, VCSEL arrays can be configured to provides multiple illumination segments to enable flexible sensing and processing.

BEAM STEERING

The flip-chip architecture enables each VCSEL or a group of VCSELs to be independently addressed. With a multi-zone design, each zone can be independently controlled. Depending on the FoV, no external lens is needed as beam steering is determined by the microlenses.

Maximum Detection Range and Resolution with Flexible FoV Configurations

TriLumina’s integrated illuminator solutions maximize detection range for a variety of use cases. It features demonstrated complete 3D solid-state LiDAR with less than 3 nanoseconds pulse width, high optical peak power, built-in segmentation, scalability and beam steering. In addition, with the use of monolithic microlenses, flexible FoV configurations can be achieved without the need for external optics. This greatly reduces the cost and size of the illumination component of the system.